Flexible Circuit Technologies Inc. (FCT), a Minnesota-based flexible circuit and advanced electronics manufacturer, has developed a Liquid Leak Detection Flex Assembly, a custom-engineered sensing solution for liquid-cooled AI servers, high-performance computing (HPC) systems, cold plates, manifolds, quick disconnects, coolant distribution units (CDUs), and other mission-critical electronics, the company announced on September 22, 2026.
The development addresses a growing risk in data centers as AI and HPC platforms shift toward direct-to-chip liquid cooling. While liquid cooling improves thermal management for power-dense processors, it introduces the potential for coolant leaks that can damage expensive hardware. FCT’s flexible sensing assembly is designed to conform to the geometry of cooling systems, enabling leak detection near potential failure points while maintaining a thin, lightweight profile in space-constrained server and rack environments.
The assembly can be customized for sensing patterns, circuit geometry, connector interfaces, and multiple detection zones. Monitoring locations include supply and return quick disconnects, GPU and CPU cold plates, manifolds, coolant lines, CDUs, and server trays. The flex-based architecture allows OEMs and cooling-system manufacturers to integrate leak sensing directly into their equipment rather than relying solely on facility-level detection, which may not identify leaks at the component level quickly enough.
“The rapid growth of liquid-cooled AI infrastructure is creating a new need for thin, compact, highly customized leak-detection solutions,” said Ray Cottrell, EVP of Flexible Circuit Technologies. “FCT’s strength is designing flexible circuits around the customer’s mechanical and electrical requirements. This concept allows us to bring that capability directly to cold plates, manifolds, quick disconnects, and server-level cooling assemblies where early detection can help protect high-value electronics.”
FCT plans to collaborate with server OEMs and ODMs, liquid-cooling companies, cold-plate manufacturers, thermal-management suppliers, and data-center infrastructure providers to tailor the assembly to specific cooling architectures. The company’s engineering team can support concept development, rapid prototyping, design-for-manufacturing, flex circuit fabrication, assembly, and scalable production.
As AI and HPC workloads push processor power densities higher, direct-to-chip liquid cooling is becoming more common. A leak that goes undetected can cause costly downtime and equipment damage. By offering a customizable flex-based sensor that fits into tight spaces, FCT aims to help equipment makers embed leak detection at the source. The move positions the company in a growing market for liquid-cooling components and reflects broader efforts to improve reliability in advanced computing infrastructure.
Flexible Circuit Technologies, Inc. (FCT), and its inTFlex EMS division, offer specialty interconnects including flexible circuits, catheters, rigid flex, flexible heaters, printed electronics and membrane switches, plastic moldings, and advanced EMS from FPCA/PCBA to complete product box builds. Celebrating over 25 years in business, FCT has an internationally recognized design team with advanced manufacturing to support fast NPI and cost-effective manufacturing solutions in Asia. More information is available at https://www.flexiblecircuit.com.
