Huawei Unveils Mate 90 Series with Flagship Tau Chipset, Setting New Mobile Benchmark

Huawei has launched its next-generation flagship HUAWEI Mate 90 Series, equipping every model with the powerful LogicFolding Tau Chip, the Kirin 9050 Pro. The announcement, made via Media OutReach Newswire, highlights a comprehensive evolution in design, performance, imaging, reliability, and smart user experience. The series aims to set a new benchmark for mobile technology, according to Richard Yu, Executive Director of Huawei and Chairman of the Huawei Consumer BG. “Through vertical integration of hardware, software, chips, and cloud, we have achieved a comprehensive evolution,” Yu stated. “Today, we step into a new era of brilliance.”

The launch underscores Huawei’s long-term commitment to research and development. Between 2007 and the end of 2025, Huawei invested a total of CNY1.8 trillion into R&D. This investment has yielded foundational advancements in Kirin chips, HarmonyOS, and other core technologies, which are now being translated into tangible product experiences. The Mate 90 series exemplifies this strategy, integrating cutting-edge hardware and software to deliver features that consumers can directly feel.

At the heart of the HUAWEI Mate 90 Pro Max is the LogicFolding Tau Chip, built on an innovative architecture that drastically compresses critical path latency to enable 5 million signal transmission bonds and an impressive 125 TB/s inter-die bandwidth. The Pro Max Premium Edition and RS ULTIMATE DESIGN are powered by the Kirin 9050 Pro chip, delivering a 31% increase in overall performance. The Pro model’s Kirin 9035 chip brings a 20% performance boost, while the standard edition’s Kirin 9030 chip offers a 27% gain. Vertically integrated with HarmonyOS 7, the Kirin 9050 Pro CPU supports hyper-threading for ultra-smooth operations, and hardware-accelerated ray tracing renders up to 55 million rays per second for advanced mobile gaming.

Imaging receives a significant upgrade with the XMAGE True-to-Color Portrait Camera. The entire series features True-to-Color Camera 3.0, which advances overall color accuracy by 37% and skin-tone accuracy by 62% through full-focal-length infrared optical coating. The updated XMAGE engine introduces four shooting modes: Portrait original, Soft light portrait, Dazzling fireworks, and Starburst. The Pro Max boasts an 18 EV ultra-HDR main camera, a 200 MP RYYB telephoto camera, and CIPA 7.5-rated hardware image stabilization. Additionally, the HUAWEI XMAGE Z10 Modular Camera offers a 1-inch large sensor, 24–240 mm continuous optical zoom, and a maximum aperture of f/2.0 to f/4.5 for studio-quality imagery.

The display technology also sees a leap forward with the second-generation Linglong Display on the Mate 90 Pro, reaching a peak brightness of 12,000 nits at 1% APL and extending panel lifespan by 138%. The Pro Max and RS ULTIMATE DESIGN debut the Full-color Linglong Display, leveraging 12,000-nit brightness and full BT.2020 color management to upsample P3 content from over 60 mainstream apps. Eye care features include industry-first ambient light detection and a 1-nit ultra-low brightness eye-comfort mode.

Connectivity is overhauled with an industry-first Wi-Fi and cellular converged antenna architecture that boosts signal gain by 2 dB. The entire lineup supports eSIM, with the Pro Max pioneering four-SIM, three-standby functionality. Multi-device communication sharing boosts photo and video upload speeds by up to 40% in congested environments. HarmonyOS AI brings a 30B MoE full-modal on-device foundation model on the Pro Max and higher models, enabling features like Celia Memories, Celia Call 2.0, and Celia Gallery Assistant. HarmonyOS 6 and 7 now power over 90 million devices, with a global developer community exceeding 11 million.

Pricing for the series starts at CNY5,999 for the Mate 90, CNY6,999 for the Mate 90 Pro, CNY9,499 for the Mate 90 Pro Max, and CNY12,999 for the Mate 90 RS ULTIMATE DESIGN. The launch signals Huawei’s continued push to redefine premium smartphones through vertical integration and sustained R&D, potentially reshaping competition in the high-end market.

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