SUSS MicroTec SE, a leading supplier of semiconductor equipment, announced its entry into the wafer-level cleaning market with the launch of the GreenTec Solutions product line and the GT200 system. The move expands the company’s portfolio into a market valued at approximately EUR 5.4 billion, driven by advanced packaging, heterogeneous integration, and rising demand from AI and high-performance computing.
The GreenTec Solutions line combines two proven technologies from SUSS’s Photomask Solutions segment: TurbulenStrip and CrustBuster. TurbulenStrip uses lower-impact batch soaking and single-wafer handling for resist and residue removal, while CrustBuster employs patented in-situ UV technology to break down organic materials directly on the wafer surface. This hybrid approach enables efficient cleaning while significantly reducing chemical consumption and eliminating hazardous acids and organic solvents, addressing the semiconductor industry’s growing environmental, social, and governance needs.
“GreenTec Solutions marks an important milestone in the execution of our Ambition 2030 strategy,” said Burkhardt Frick, CEO of SUSS. “By expanding into wafer-level cleaning, we are entering an attractive market with significant long-term growth potential while leveraging proven technologies and process expertise from our existing portfolio.”
The GT200, the first platform in the line, is designed for 200 mm process development, qualification, and production for MEMS, RF, power device, and CMOS applications. It consolidates photoresist removal, surface activation, and final cleaning into one configurable tool, reducing wafer transfers and toolset complexity. SUSS supports customers with joint evaluation programs, process co-development, and recipe optimization to accelerate adoption and de-risk technology transfers.
“The GreenTec Solutions product line represents our vision for the next generation of semiconductor manufacturing—where sustainability and process excellence go hand in hand,” said Yuta Nagai, Senior Vice President Photomask Solutions at SUSS. “Due to the strong interest from our customers, we are pulling in the launch of a 300 mm HVM solution.”
SUSS plans to introduce a dedicated 300 mm high-volume manufacturing platform in 2027, followed by a 200 mm HVM platform in 2028, providing customers a clear migration path from evaluation to full-scale production. The company will showcase the GT200 and host product deep dives at SEMICON West, with registration available via https://www.suss.com/en/company/events/semicon-west. More details about the GT200 are available at https://www.suss.com/en/products-solutions/greentec-solutions/wafer-cleaning/gt200. The original release can be viewed on www.newmediawire.com.
